MICROSTRUCTURE CHARACTERISTICS AT THE BOND INTERFACE

作     者：Li Junhui Han Lei Zhong Jue 

作者机构：College of MechanicaI-Electronical Engineering Central South University Changsha 410083 China 

出 版 物：《Chinese Journal of Mechanical Engineering》 (中国机械工程学报（英文版）)

年 卷 期：2005年第18卷第4期

页      面：555-558页

核心收录：

学科分类：080503[工学-材料加工工程] 0817[工学-化学工程与技术] 08[工学] 0807[工学-动力工程及工程热物理] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0811[工学-控制科学与工程] 0801[工学-力学（可授工学、理学学位）] 080201[工学-机械制造及其自动化] 

基　　金：This project is supported by National Natural Science Foundation of China (No.50390064)National Basic Research Program of China(973 Program No.2003CB716202) 

主　　题：Bonded interface Thermosonic bonding Microstructure 

摘      要：Lift-off and section characteristics at the interface of thermosonic bond are observed by using scanning electron microscope （KYKY2800） with EDS-test. Results show that the peeling underdeveloped bonds simulate atorns （or doughnut） with an unbonded central region and ridged peripheral region is bonded hardly, Inside roundness at flip chip bonding center are discovered. Bond strength is located between the severely ridged periphery and the non-adhering central area of the bond. For constant force and time, the ridged area of the bond pattern increases when more power is applied. For constant force and power, the ridged location of the bonded region moves closer to the bond center with time. Results of EDS-tests at Au-Al and Au-Ag interfaces show that Kirkendall diffusibility at Au-Ag interface occur and the diffusing speed of Au-atomic is faster than that of Ag, and that intermetallic compounds at Au-Al interface is generated possibly. And these would be helpful for further research about thermosonic bonding.