Effect of chemical plating Zn on DC-etching behavior of Al foil in HCl-H_2SO_4

作     者：班朝磊 何业东 邵鑫 杜鹃 王利平 Chao-lei BAN;Ye-dong HE;Xin SHAO;Juan DU;Li-ping WANG

作者机构：聊城大学材料科学与工程学院有色金属研究院聊城252059 北京科技大学北京市腐蚀磨蚀与表面技术重点实验室北京100083 

出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报（英文版）)

年 卷 期：2013年第23卷第12期

页      面：3650-3657页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：Project (51172102) supported by the National Natural Science Foundation of China Project (BS2011CL011) supported by Promotive Research Fund for Young and Middle-aged Scientists of Shandong Province(doctor fund),China 

主　　题：Al foil polarization pitting corrosion electrochemical etching Al electrolytic capacitor 

摘      要：The Al foil for high voltage Al electrolytic capacitor usage was immersed in 5.0%NaOH solution containing trace amount of Zn2＋and Zn was chemically plated on its surface through an immersion-reduction reaction. Such Zn-deposited Al foil was quickly transferred into HCl-H 2 SO 4 solution for DC-etching. The effects of Zn impurity on the surface and cross-section etching morphologies and electrochemical behavior of Al foil were investigated by SEM, polarization curve （PC） and electrochemical impedance spectroscopy （EIS）. The special capacitance of 100 V formation voltage of etched foil was measured. The results show that the chemical plating Zn on Al substrate in alkali solution can reduce the pitting corrosion resistance, enhance the pitting current density and improve the density and uniform distribution of pits and tunnels due to formation of the micro Zn-Al galvanic local cells. The special capacitance of etched foil grows with the increase of Zn2＋concentration.