Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface

作     者：孟工戈 TAKEMOTO Tadashi NISHIKAWA Hiroshi 

作者机构：School of Material Science & EngineeringHarbin University of Science and Technology Joining and Welding Research InstituteOsaka University 

出 版 物：《Journal of Harbin Institute of Technology(New Series)》 (哈尔滨工业大学学报（英文版）)

年 卷 期：2009年第16卷第5期

页      面：648-651页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 1305[艺术学-设计学（可授艺术学、工学学位）] 1304[艺术学-美术学] 13[艺术学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 

主　　题：Sn-3Ag-0. 5Cu solder IMC Ni/Co morphology type 

摘      要：The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint *** data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and *** addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size *** electron probe microanalysis (EPMA) determines the chemical compositions and confirms that the IMC is changed into the (Cu,Co,Ni)6Sn5+(Cu,Co,Ni)3Sn4 mixed type from the type of Cu6Sn5 with the elements Ni and Co in the solder.