Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere

作     者：Mingna Wang Chuang Qiao Xiaolin Jiang Long Hao Xiahe Liu Mingna Wang;Chuang Qiao;Xiaolin Jiang;Long Hao;Xiahe Liu

作者机构：Department of PhysicsHebei Normal University of Science&TechnologyQinhuangdao 066004China School of MetallurgyNortheastern UniversityShenyang 110819China Environmental Corrosion Centre of MaterialsInstitute of Metal ResearchChinese Academy of SciencesShenyang 110016China School of Material Science and EngineeringUniversity of Science and Technology of ChinaHefei 230026China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2020年第47卷第16期

页      面：40-53页

核心收录：

学科分类：080503[工学-材料加工工程] 0817[工学-化学工程与技术] 0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0802[工学-机械工程] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：financially supported by the National Natural Science Foundation of China(No.51601057) 

主　　题：SAC305 solder Marine atmosphere Galvanic corrosion In-situ EIS Comb-like electrode 

摘      要：Motivated by the increasing use of Sn-3.0 Ag-0.5 Cu(SAC305)solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds(IMCs)inβ-Sn matrix,comb-like electrodes have been designed for in-situ EIS measurements to study the microstructure induced galvanic corrosion evolution of SAC305 solder in simulated marine atmosphere with high-temperature and *** indicate that in-situ EIS measurement by comb-like electrodes is an effective method for corrosion evolution behavior study of SAC305 ***,the galvanic effect between Ag3Sn IMCs andβ-Sn matrix can aggravate the corrosion of both as-received and furnace-cooled SAC305 solder as the exposure time proceeds in spite of the presence of corrosion product *** corrosion can be preferentially found on furnace-cooled SAC305 with larger Ag3Sn grain ***,the generated inner stress during phases transformation process with Sn3O(OH)2Cl2 as an intermediate and the possible hydrogen evolution at local acidified sites are supposed to be responsible for the loose,porous,cracked,and non-adherent corrosion product *** findings clearly demonstrate the corrosion acceleration behavior and mechanism of SAC305 solder,and provide potential guidelines on maintenance of microelectronic devices for safe operation and longer in-service duration.