Solder paste metamorphism

作     者：Fu-Wen Zhang Hui-Jun He Zhi-Gang Wang Gang Lin Jie Zhu Jiang-Song Zhang Shao-Ming Zhang Fu-Wen Zhang;Hui-Jun He;Zhi-Gang Wang;Gang Lin;Jie Zhu;Jiang-Song Zhang;Shao-Ming Zhang

作者机构：General Research Institute for Nonferrous MetalsBeijing 100088China Beijing COMPO Advanced Technology Co.LtdBeijing 101407China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2021年第40卷第5期

页      面：1329-1336页

核心收录：

学科分类：080503[工学-材料加工工程] 0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0802[工学-机械工程] 0702[理学-物理学] 080201[工学-机械制造及其自动化] 

基　　金：financially supported by National Key R&D Program of China(No.2017YFB0305700) 

主　　题：Solder powder Micro-morphology Metamorphic solder paste Surface corrosion 

摘      要：Solder paste quality can be improved from microstructure and surface status of the solder *** this work,the micro-morphology of solder paste was observed and the particle surface condition was ***,the conditions of corrosion and the corrosion products in different organic acid groups(activators)were *** result shows that the SnO passive film on the solder powder surface reacts with the COO-in the active agent of the solder *** reaction led the passivation layer to be peeled *** also caused the change in solder powders’physical and chemical properties and made the metal boundary to be *** is the root cause of solder paste exsiccation and *** study on the details shows that to obtain high-quality solder paste,one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.