Investigation of gate oxide traps effect on NAND flash memory by TCAD simulation
Investigation of gate oxide traps effect on NAND flash memory by TCAD simulation作者机构:School of Materials Science and EngineeringShanghai Jiao Tong UniversityShanghai 200240China SanDisk Info Tech ShanghaiShanghai 200241China
出 版 物:《Chinese Physics B》 (中国物理B(英文版))
年 卷 期:2020年第29卷第3期
页 面:448-454页
核心收录:
学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 0704[理学-天文学] 081201[工学-计算机系统结构] 0812[工学-计算机科学与技术(可授工学、理学学位)]
基 金:Project supported by the San Disk Info Tech Shanghai,China the Institute of Microelectronic Materials&Technology,School of Materials Science and Engineering,Shanghai Jiao Tong University,China
主 题:NAND flash reliability gate oxide traps trap-assisted tunneling TCAD simulation
摘 要:The effects of gate oxide traps on gate leakage current and device performance of metal–oxide–nitride–oxide–silicon(MONOS)-structured NAND flash memory are investigated through Sentaurus TCAD. The trap-assisted tunneling(TAT)model is implemented to simulate the leakage current of MONOS-structured memory cell. In this study, trap position, trap density, and trap energy are systematically analyzed for ascertaining their influences on gate leakage current, program/erase speed, and data retention properties. The results show that the traps in blocking layer significantly enhance the gate leakage current and also facilitates the cell program/erase. Trap density ~10^(18) cm^(-3) and trap energy ~ 1 eV in blocking layer can considerably improve cell program/erase speed without deteriorating data retention. The result conduces to understanding the role of gate oxide traps in cell degradation of MONOS-structured NAND flash memory.