咨询与建议

看过本文的还看了

相关文献

该作者的其他文献

文献详情 >(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2Zr... 收藏

(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2Zr2O7:A novel high-entropy ceramic with low thermal conductivity and sluggish grain growth rate

(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2Zr2O7:A novel high-entropy ceramic with low thermal conductivity and sluggish grain growth rate

作     者:Zifan Zhao Huimin Xiang Fu-Zhi Dai Zhijian Peng Yanchun Zhou 

作者机构:School of Engineering and TechnologyChina University of GeosciencesBeijing 100083China Science and Technology on Advanced Functional Composite LaboratoryAerospace Research Institute of Materials&Processing TechnologyBeijing 100076China 

出 版 物:《Journal of Materials Science & Technology》 (材料科学技术(英文版))

年 卷 期:2019年第35卷第11期

页      面:2647-2651页

核心收录:

学科分类:07[理学] 070205[理学-凝聚态物理] 08[工学] 0806[工学-冶金工程] 0805[工学-材料科学与工程(可授工学、理学学位)] 0702[理学-物理学] 

基  金:financially supported by the National Natural Science Foundation of China (Nos.51672064 and U1435206) 

主  题:(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2Zr2O7 High-entropy ceramics Thermal barrier coatings Slow grain growth rate 

摘      要:Fine grains and slow grain growth rate are beneficial to preventing the thermal stress-induced cracking and thermal conductivity increase of thermal barrier coatings.Inspired by the sluggish diffusion effect of high-entropy materials,a novel high-entropy(HE)rare-earth zirconate solid solution(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2 Zr2 O7 was designed and successfully synthesized in this work.The as-synthesized(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2 Zr2 O7 is phase-pure with homogeneous rare-earth element distribution.The thermal conductivity of as-synthesized(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2 Zr2 O7 at room temperature is as low as 0.76 W m^-1 K^-1.Moreover,after being heated at 1500℃for 1-18 h,the average grain size of(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2 Zr2 O7 only increases from 1.69μm to 3.92μm,while the average grain size of La2Zr2O7 increases from 1.96μm to 8.89μm.Low thermal conductivity and sluggish grain growth rate indicate that high-entropy(La0.2Ce0.2Nd0.2Sm0.2Eu0.2)2Zr2O7 is suitable for application as a thermal barrier coating material and it may possess good thermal stress-induced cracking resistance.

读者评论 与其他读者分享你的观点

用户名:未登录
我的评分