In situ investigation of atmospheric corrosion behavior of PCB-ENIG under adsorbed thin electrolyte layer
原位研究PCB-ENIG在吸附薄液膜下的大气腐蚀行为（英文）作者机构：北京科技大学腐蚀与防护中心北京100083 中国船舶重工集团公司第七二五研究所海洋腐蚀与防护国家重点实验室青岛266101 中国科学院宁波材料技术与工程研究所宁波315201
出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报（英文版）)
年 卷 期：2016年第26卷第4期
页 面：1146-1154页
核心收录：
学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）]
基 金：Project(51271032)supported by the National Natural Science Foundation of China Project(2014CB643300)supported by the National Basic Research Program of China Project supported by the National Environmental Corrosion Platform,China
主 题：electronic materials adsorbed thin electrolyte layer cathodic polarization curve electrochemical impedance spectroscopy relative humidity
摘 要：The effects of relative humidity (RH) on a printed circuit board finished with electroless nickel immersion gold (PCB-ENIG) under an adsorbed thin electrolyte layer (ATEL) were investigated in situ via the measurement of cathodic polarization curves, electrochemical impedance spectroscopy, scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy to clearly elaborate the corrosion behavior of PCB-ENIG in the atmospheric environment. Results indicated that the cathodic process of PCB-ENIG under ATEL was dominated by the reduction of dissolved oxygen, corrosion products, and H2O. The cathodic current density of PCB-ENIG increased progressively with increasing RH. Moreover, its cathodic current density in the solution was greater than that under ATEL. This result demonstrated that the diffusion process was not the controlling step during the limiting reduction of cathodic oxygen. When the polarization potentials were located in a more negative region, the cathodic polarization current density gradually decreased under 75% and 85% RH. Notably, the anodic process became the controlling step in the extremely thin liquid film during the remainder of the experiment.
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