Effect of thermal deformation parameters on the microstructure, texture, and microhardness of 5754 aluminum alloy

作     者：Chang-qing Huang Jia-xing Liu Xiao-dong Jia 

作者机构：School of Mechanical and Electrical EngineeringCentral South UniversityChangsha 410083China State Key Laboratory of High-performance Complicated ManufacturingCentral South UniversityChangsha 410083China Light Alloys Research InstituteCentral South UniversityChangsha 410083China 

出 版 物：《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报（英文版）)

年 卷 期：2019年第26卷第9期

页      面：1140-1150页

核心收录：

学科分类：0806[工学-冶金工程] 08[工学] 

基　　金：financial support from the Natural Science Foundation of China (No. 51275533) the State Key Laboratory of High-Performance Complex Manufacturing (No. zzyjkt2013-10B),Central South University, China the portion provided by the Academician Workstation Foundation of Yinhai Aluminum Industry Co., Ltd., Liuzhou, China 

主　　题：microstructure texture misorientation dynamic recrystallization microhardness 

摘      要：The evolution of the microstructure, texture, and microhardness of 5754 aluminum alloy subjected to high-temperature plastic deformation under different deformation conditions was studied on the basis of thermal simulations and electron-backscattered diffraction and Vickers microhardness experiments. The results of a misorientation angle study show that an increase in the deformation temperature and strain rate promoted the transformation of low-angle grain boundaries to high-angle grain boundaries, which contributed to dynamic recrystallization. The effect of the deformation parameters on the texture and its evolution during the recrystallization process was explored on the basis of the orientation distribution function. The results demonstrate that the deformed samples mainly exhibited the features of type A, B, and B textures. The formation and growth of the recrystallized grains clearly affected the texture evolution. The microhardness results show that the variation of the microhardness was closely related to the temperature, strain rate, and dynamic recrystallization.