MEMS Test System Based on Virtual Instrument Technology

作     者：胡晓东 栗大超 郭彤 胡春光 胡小唐 HU Xiaodong , LI Dachao , GUO Tong , HU Chunguang , HU Xiaotang (State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University, Tianjin 300072, China)

作者机构：State Key Laboratory of Precision Measuring Technology and Instruments Tianjin University 

出 版 物：《Transactions of Tianjin University》 (天津大学学报（英文版）)

年 卷 期：2007年第13卷第2期

页      面：88-92页

核心收录：

学科分类：08[工学] 080401[工学-精密仪器及机械] 0804[工学-仪器科学与技术] 081102[工学-检测技术与自动化装置] 0811[工学-控制科学与工程] 

基　　金：Supported by National Natural Science Foundation of China (No.50505031) Tianjin Municipal Science and Technology Commission(No.043185911) Programfor NewCentury Excellent Talents in University 

主　　题：MEMS optical measurement technique stroboscopic imaging virtual instrument dynamic test 

摘      要：On account of the multiformity of MEMS devices, it is necessary to integrate with some optical measurement techniques for meeting static and dynamic unit test requirements. In this paper, an automated MEMS test system is built of some commercially available components and instruments based on virtual instrument technology. The system is integrated with stroboscopic imaging, computer micro-vision, microscopic Mirau phase shifting interferometry, and laser Doppler vibrometer, and is used for the measurement of full-view in-plane and out-of-plane geometric parameters and periodical motions and single spot out-of-plane transient motion. The system configuration and measurement methods are analyzed, and some applications of the measurement of in-plane and out-of-plane dimensions and motions were described. The measurement accuracy of in-plane dimensions and out-of-plane dimensional is better than 0.2 um and 5 nm respectively. The resolution of measuring in-plane and out-of-plane motions is better than 15 nm and 2 nm respectively.