Laser cladding of Ni-based alloy on copper substrate

作     者：Fang Liu Changsheng Liu Xingqi Tao Suiyuan Chen 

作者机构：School of Material and Metallurgy Northeastern University Shenyang 110004 China 

出 版 物：《Journal of University of Science and Technology Beijing》 (北京科技大学学报（英文版）)

年 卷 期：2006年第13卷第4期

页      面：329-332页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：This research was financially supported by the National Natural Science Foundation of China (No.50574020) and Shanghai BaoSteel Group Co 

主　　题：copper laser cladding nickel-based alloy solid solution 

摘      要：The laser cladding of Ni1015 alloy on Cu substrate was prepared by a high power continuous wave CO2 laser. Its microstructure was analyzed by optical microscope （OM）, scanning electron microscope （SEM）, and X-Ray diffraction （XRD）. The average microhardness of the cladding coating was Hv 280, which was almost three times of that of the Cu substrate （Hv 85）. OM and SEM observations showed that the obtained coating had a smooth and uniform surface, as well as a metallurgical combination with the Cu substrate without cracks and pores at the interface. With the addition of copper into the nickel-based alloy, the differences of thermal expansion coefficient and melting point between the interlayer and cladding were reduced, which resulted in low stresses during rapid cooling. Moreover, large amount of （Cu, Ni） solid solution formed a metallurgical bonding between the cladding coating and the substrate, which also relaxed the stresses, leading to the reduction of interfacial cracks and pores after laser cladding.