Influence of copper on quality of hot strips by EAF-CSP process

作     者：YuanliWang DeluLiu WeiranShao JieFu YonglinKang DeguangZhou ZhongbingWang 

作者机构：MaterialsScienceandEngineeringSchoolUniversityofScienceandTechnologyBeijingBeijing100083China MetallurgicalEngineeringSchoolUniversityofScienceandTechnologyBeijingBeijing100083China GuanzhouZhujiangIronandSteelCo.Ltd.Guangzhou510620China 

出 版 物：《Journal of University of Science and Technology Beijing》 (北京科技大学学报（英文版）)

年 卷 期：2004年第11卷第1期

页      面：57-61页

核心收录：

学科分类：080602[工学-钢铁冶金] 08[工学] 0806[工学-冶金工程] 

主　　题：Cu segregation surface flaws CSP hot strips copper sulfide nano-scaledprecipitates 

摘      要：Electron microscopy and X-ray Energy Dispersive Spectroscopy (XEDS) study oninfluence of Cu on low carbon hot strips produced by CSP (Compact Strip Production) process has beencarried out. The results indicated that copper segregation and enrichment at interfacial layerbetween oxidized surface and steel matrix is the key factor, which results in microcracks and edgeflaws on the strips. The primary considerations to prevent detrimental effects from Cu includecontrolling copper content in proper level, higher soaking temperature and non-oxidizable atmosphereduring soaking. Copper sulfide precipitates with nanometers in size were observed, they may bebeneficial to the properties of CSP products, and influence of Cu on quality of CSP hot strips isdiscussed.