Residual stress evolution regularity in thermal barrier coatings under thermal shock loading

作     者：Ximin Chen Zhanwei Liu Yang Yang 

作者机构：School of Aerospace EngineeringBeijing Institute of Technology 

出 版 物：《Theoretical & Applied Mechanics Letters》 (力学快报（英文版）)

年 卷 期：2014年第4卷第2期

页      面：52-58页

学科分类：08[工学] 080102[工学-固体力学] 0801[工学-力学（可授工学、理学学位）] 

基　　金：supported by the National Natural Science Foundation of China(91216301,11072033,11232008,and 11372037) the Program for New Century Excellent Talents in University(NCET-12-0036) the Natural Science Foundation of Beijing,China(3122027) 

主　　题：thermal barrier coating residual stress DIC hole-drilling method micro-Raman spectroscopy 

摘      要：Residual stress evolution regularity in thermal barrier ceramic coatings （TBCs） under different cycles of thermal shock loading of 1 100℃ was investi- gated by the microscopic digital image correlation （DIC） and micro-Raman spec- troscopy, respectively. The obtained results showed that, as the cycle number of the thermal shock loading increases, the evolution of the residual stress under- goes three distinct stages： a sharp increase, a gradual change, and a reduction. The extension stress near the TBC surface is fast transformed to compressive one through just one thermal cycle. After different thermal shock cycles with peak temperature of 1 100℃, phase transformation in TBC does not happen, whereas the generation, development, evolution of the thermally grown oxide （TGO） layer and micro-cracks are the main reasons causing the evolution regularity of the residual stress.