Bonding Interface Imaging and Shear Strength Prediction by Ultrasound1
Bonding Interface Imaging and Shear Strength Prediction by Ultrasound1作者机构：State Key Laboratory of Acoustics Institute of Acoustics Chinese Academy of Sciences Beijing 100190
出 版 物：《Chinese Physics Letters》 (中国物理快报（英文版）)
年 卷 期：2010年第27卷第6期
页 面：118-121页
核心收录：
学科分类：081702[工学-化学工艺] 081704[工学-应用化学] 07[理学] 08[工学] 0817[工学-化学工程与技术] 070305[理学-高分子化学与物理] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学]
基 金：Supported by the National Natural Science Foundation of China under Grant No 10834009
主 题：Adhesives Stickiness Shears Strength Forecasting Shearing Thickness Economic distribution
摘 要：The propagation of a longitudinal ultrasonic wave normally incident upon an adhesively bonded structure is stud- ied. The structure consists of adherend and adhesive layers with finite thickness. Interfaces between adherend and adhesive are regarded as distributed springs. Theoretical and experimental results show that resonant frequencies of the bonded structure vary sensitively with the interface stiffness constants and adhesive thickness, and these interface characteristics are inversed by the simulation annealing （SA） method. Furthermore, the distribution image of interface stiffnesses is compared with the state of fracture interface, and quantitative prediction of shear strength is achieved based on the distribution of interface stiffnesses and adhesive thicknesses by using a back- propagation neutral network. The average relative error of the shear strength from prediction to real value is 10.7%.
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