Correlating solder interconnects failure with PCBs response during board level drop impact test

作     者：刘洋 孙凤莲 

作者机构：School of Materials Science and EngineeringHarbin University of Science and TechnologyHarbin150030 

出 版 物：《China Welding》 (中国焊接（英文版）)

年 卷 期：2012年第21卷第2期

页      面：7-12页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 07[理学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 071102[理学-系统分析与集成] 0711[理学-系统科学] 0817[工学-化学工程与技术] 081104[工学-模式识别与智能系统] 0807[工学-动力工程及工程热物理] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0811[工学-控制科学与工程] 0801[工学-力学（可授工学、理学学位）] 081103[工学-系统工程] 

基　　金：Supported by National Natural Science Foundation of China (No. 51075107 No. 51174069) and Key Project of Natural Science Foundation of Heilongjiang Province (No. ZD200910) 

主　　题：solder printed circuit board drop impact strain failure 

摘      要：Solder interconnects reliability during drop impact is important for portable electronic products. In this paper, board level drop impact tests were conducted according to the standard of the Joint Electronic Devices Engineering Council （JEDEC）. Solder failure drop numbers were recorded and solder failure analyses were carried out. A high speed data acquisition system was constructed to measure the printed cireuit board （ PCt~ ） dynamic response during the impact. Measured response data were used to characterize the loading feature of the impact. The relatioT~~hip between solder failure features and PCB dynamic response was correlated. Solder failure mechanisms were discussed. The correlation of PCB strain data with the solder failure life indicates that the solder damage accumulated during drop impact is dependent on both strain amplitude and modes contribution of the PCB. Compared with high strain amplitude loading condition, lower strain amplitude with higher mode can even produce more severe damage to the solder interconnects. Repeated impact loadings to the solder induce the combination failure mechanism of both impact and fatigue. Failure analyses results provide convincing verification for the complexity of the failure mechanisms.