Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing process

作     者：WEI Xiaofeng WANG Richu FENG Yan ZHU Xuewei PENG Chaoqun WEI Xiaofeng,WANG Richu,FENG Yan,ZHU Xuewei,and PENG Chaoqun School of Materials Science and Engineering,Central South University,Changsha 410083,China

作者机构：School of Materials Science and Engineering Central South University Changsha 410083 China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2011年第30卷第6期

页      面：627-632页

核心收录：

学科分类：0810[工学-信息与通信工程] 080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 081001[工学-通信与信息系统] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

主　　题：Au-Sn solders intermetallic compounds (IMCs) rolling-annealing method interfacial reaction microstructural evolution 

摘      要：The microstructural evolution and inteffacial reaction of the Au/Sn/Au/Sn/Au/Sn/Au couples were investigated during annealing at 453, 523, and 543 K for up to 240 h. The Au/Sn combination formed a rapid diffusion system. Even in rolled Au-Sn solder, three phases, such as AuSn, AuSn2, and AuSn4, were formed. After initial annealing at 453 K, the diffusion layers of AuSn, AuSn2, and AuSn4, which were formed after rolling, expanded gradually and then fully transformed into phase （containing Sn from 10% to 18.5%, mole fraction） and 6 （AuSn） phase. As a whole, the microstmcture of the couple was stable during annealing at 453 K. The solid-state interracial reaction was much faster at 523 K than at 453 K. After annealing at 523 K for 6 h, the AuSn, AuSn2, and AuSn4 were fully transformed into the phase and phase （AuSn）. In spite of the prolonged annealing time for up to 240 h, no significant change of the interfacial microstructure occurred, and the microstructure of the couple was stable during annealing at 523 K. When annealing at 543 K, however, the interfacial of Au/Sn was transformed into solid-liquid state, and the whole couple formed a eutecfic structure rapidly, causing the solder to be brittle. The study results clearly demonstrate that the service temperature of the Au-Sn solder should be lower than 543 K.