THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY

作     者：王维 吴选征 漆宗能 

作者机构：State Key Laboratory of Engineering Plastics Institute of Chemistry Academia Sinica Beijing 100080 

出 版 物：《Chinese Journal of Polymer Science》 (高分子科学（英文版）)

年 卷 期：1992年第10卷第1期

页      面：81-88页

核心收录：

学科分类：081704[工学-应用化学] 07[理学] 08[工学] 0817[工学-化学工程与技术] 070305[理学-高分子化学与物理] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 

基　　金：The project supported by National Natural Science Foundation of China 

主　　题：Epoxy Cure mechanism Cure kinetics DSC 

摘      要：The cure reaction of tetraglycidyl 4,4 -diaminodiphenyl methane (TGDDM) epoxy resin with 4,4 -diaminodiphenyl methane (DDM) has been studied by using DSC. Instead of one exothermic peak, two exothermic peaks, indicative of a complex reaction mechanism, are shown in the DSC curve of TGDDM-DDM mixtures in nonisothermal cure experiments when the content of DDM is lower than stoichiometric ratio. The result of the kinetic analysis of the cure reaction shows that the activation energy of the lower temperature exotherm peak is about 56 kJ/mol and that of the higher temperature exotherm peak is about 136 kJ/mol. The lower temperature cure reaction peak can be attributed to the primary amine-epoxide and secondary amine-epoxide reactions, and the higher temperature cure reaction peak can be attributed to the epoxide-hydroxy reaction under catalysis of tertiary amine in the TGDDM epoxy resin. Because the network density of the cured epoxy resin is determined by these two reactions, the content of DDM has little effect on the glass transition temperature of cured epoxy resin.