ADHESIVE CONTACT PROBLEM OF AXISYMMETRIC MINIATURE CIRCULAR PLATES WITH CENTRAL RIGID BUMP

作     者：Fu Yiming Li Sheng Tian Yanping 

作者机构：Department of Engineering Mechanics Hunan University Changsha 410082 China 

出 版 物：《Acta Mechanica Solida Sinica》 (固体力学学报（英文版）)

年 卷 期：2006年第19卷第4期

页      面：341-351页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 

基　　金：Project supported by the National Natural Science Foundation of China (No. 10572049) 

主　　题：miniature hesive contact geometric circular plate two different central rigid bumps elastic substrate adnonlinearity 

摘      要：Considering the adhesive effect and geometric nonlinearity, the adhesive contact between an elastic substrate and a clamped miniature circular plate with two different central rigid bumps under the action of uniform transverse pressure and in-plane tensile force in the radial direction was analyzed. And an analytical solution is presented by using the perturbation method. The relation of surface adhesive energies with critical load to detach the contacted surfaces is obtained. In the numerical results, the effects of adhesive energy, in-plane tensile force, rigid bump size and contact radius on the critical load are discussed, and the relation of critical contact radius with the gap between the central rigid bump and the substrate for different adhesive energies is investigated.