Characterization of the arrangement feature of copper interconnects by Moir inversion method

作     者：Qinghua Wang Satoshi Kishimoto Huimin Xie Kewei Xu Jianfeng Wang 

作者机构：National Institute for Materials ScienceTsukubaIbaraki 305-0047Japan AMLDepartment of Engineering MechanicsTsinghua UniversityBeijing 100084China School of Materials Science and EngineeringXi'an Jiaotong UniversityXi'an 710049China 

出 版 物：《Theoretical & Applied Mechanics Letters》 (力学快报（英文版）)

年 卷 期：2012年第2卷第2期

页      面：37-40页

学科分类：080903[工学-微电子学与固体电子学] 081801[工学-矿产普查与勘探] 081802[工学-地球探测与信息技术] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0818[工学-地质资源与地质工程] 

基　　金：supported by the JSPS Postdoctoral Fellowship for Foreign Researchers the National Basic Research Program of China ("973" Project) (2010CB631005,2011CB606105) the National Natural Science Foundation of China (11172151,90916010) Specialized Research Fund for the Doctoral Program of Higher Education(20090002110048) 

主　　题：copper interconnects arrangement Moire inversion method focused ion-beam 

摘      要：This paper explores the planar arrangement feature of the copper interconnects in a view field of several millimeters by the focused ion-beam （FIB） Moire inversion method quantitatively. The curved FIB Moire patterns indicate that the copper interconnects are a series of curves with continuous variations instead of beelines. The control equation set of the copper interconnects central lines is attained through the Moire inversion method. This work can be extended to inspect the structural defects and provide a reliable support for the interconnects structure fabrication.