Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature

作     者：F. Yan H. W. Zhang N.R. Tao K. Lu 

作者机构：Shenyang National Laboratory for Materials Science Institute of Metal Research Chinese Academy of Sciences Shenyang 110016 China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2011年第27卷第8期

页      面：673-679页

核心收录：

学科分类：080705[工学-制冷及低温工程] 080503[工学-材料加工工程] 07[理学] 070205[理学-凝聚态物理] 08[工学] 0807[工学-动力工程及工程热物理] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 0702[理学-物理学] 

基　　金：the Danish National Research Foundation and the National Natural Science Foundation of China (Grant No. 50911130230)for the Danish-Chinese center for Nanometals, within which this study was performed sponsored by MOST international S&T project(2010DFB54010), SRF for ROCS, SEM, and the Young Merit Scholar of Institute of Metal Research, Chinese Academy of Science, China 

主　　题：Quantitative structural characterization Cu Dynamic plastic deformation Trans mission electron microscopy Convergent beam electron diffraction 

摘      要：A pure Cu （99.995 wt%） has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy （TEM） assisted by convergent beam electron diffraction （CBED） analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries （〈15°） that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect ∑3 coincidence （60°/〈111〉） up to the maximum angle of 9°. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship.