Design of a 3D Wilkinson power divider using through glass via technology

作     者：Jifei Sang Libo Qian Yinshui Xia Huakang Xia 

作者机构：Faculty of Electrical Engineering and Computer Science Ningbo University 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2018年第39卷第12期

页      面：197-200页

核心收录：

学科分类：0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0702[理学-物理学] 

基　　金：Projected supported by the National Natural Science Foundation of China(Nos.61771268,61571248,U1709218) the Science and Technology Fund of Zhejiang Province(No.2015C31090) the Natural Science Foundation of Zhejiang(No.LY17F040002) the K.C.Wong Magna Fund in Ningbo University 

主　　题：3D integration glass interposer through glass vias power divider 

摘      要：Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study,through glass vias(TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed.Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.