Multiscale simulation of nanometric cutting of single crystal copper——effect of different cutting speeds

作     者：Hongmin PEN Qingshun BAI Yingchun LIANG Mingjun CHEN 

作者机构：School of Mechatronics Engineering Harbin Institute of Technology Harbin 150001 China 

出 版 物：《Acta Metallurgica Sinica(English Letters)》 (金属学报（英文版）)

年 卷 期：2009年第22卷第6期

页      面：440-446页

核心收录：

学科分类：080503[工学-材料加工工程] 0817[工学-化学工程与技术] 0806[工学-冶金工程] 08[工学] 0807[工学-动力工程及工程热物理] 080203[工学-机械设计及理论] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0703[理学-化学] 0811[工学-控制科学与工程] 080201[工学-机械制造及其自动化] 

基　　金：supported by National Natural Science Foundation of China(Nos.50675050 and 50705023) Outstanding Youth Science Foundation of Hei-longjiang Province (No.JC200614) 

主　　题：Multiscale simulation Nanometric cutting Single crystal copper Propagation speed of plastic wave 

摘      要：A multiscale simulation has been performed to determine the effect of the cutting speed on the deformation mechanism and cutting forces in nanometric cutting of single crystal copper. The multiscale simulation model, which links the finite element method and the molecular dynamics method, captures the atomistic mechanisms during nanometric cutting from the free surface without the computational cost of full atomistic simulations. Simulation results show the material deformation mechanism of single crystal copper greatly changes when the cutting speed exceeds the material static propagation speed of plastic wave. At such a high cutting speed, the average magnitudes of tangential and normal forces increase rapidly. In addition, the variation of strain energy of work material atoms in different cutting speeds is investigated.