Solid state interfacial reactions in electrodeposited Cu/Sn couples

作     者：汤文明 D. G. IVEY 

作者机构：School of Materials Science and Engineering Hefei University of Technology Department of Chemical and Materials Engineering University of Alberta Edmonton Alberta T6G 2G6 Canada 

出 版 物：《中国有色金属学会会刊：英文版》 (Transactions of Nonferrous Metals Society of China)

年 卷 期：2010年第20卷第1期

页      面：90-96页

核心收录：

学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术] 

基　　金：the Natural Sciences and Engineering Research Council (NSERC) of Canada and Micralyne  Inc. for providing research funding and Si substrates for electroplating (Micralyne) 

主　　题：电镀铜 固态反应 锡 退火温度 生长动力学 种族 金属硅 微结构 

摘      要：Cu/Sn couples, prepared by sequentially electroplating Cu and Sn layers on metallized Si wafers, were employed to study the microstructures, phases and the growth kinetics of Cu-Sn intermediate phases, when electroplated Cu/Sn couples were aged at room temperature or annealed at temperatures from 373 K to 498 K for various time. Only Cu6Sn5 formed in aged couples or couples annealed at temperature below 398 K. The Cu6Sn5 layer was continuous, but not uniform, with protrusions extending into the Sn matrix. When Cu/Sn couples were annealed at temperatures from 423 K to 498 K, two continuous and uniform Cn6Sn5/Cu3Sn layers formed within the reaction region between Sn and Cu. There were many voids near the Cu3Sn/Cu interface and within the Cu3Sn layer. Cu6Sn5 and Cu3Sn formations both follow parabolic growth kinetics with activation energies of 41.4 kJ/mol for Cu6Sn5 and 90.4 kJ/mol for Cu3Sn, respectively.