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Recent progress on non-thermal plasma technology for high barrier layer fabrication

Recent progress on non-thermal plasma technology for high barrier layer fabrication

作     者:Haibao ZHANG Lijun SANG Zhengduo WANG Zhongwei LlU Lizhen YANG Qiang CHEN 张海宝;桑利军;王正铎;刘忠伟;杨丽珍;陈强

作者机构:Laboratory of Plasma Physics and MaterialsBeijing Institute of Graphic CommunicationBeijing 102600People's Republic of China 

出 版 物:《Plasma Science and Technology》 (等离子体科学和技术(英文版))

年 卷 期:2018年第20卷第6期

页      面:1-16页

核心收录:

学科分类:07[理学] 070204[理学-等离子体物理] 0702[理学-物理学] 

基  金:financially supported by National Natural Science Foundation of China (Nos.11505013,11775028) Beijing Municipal Excellent Talent Training Foundation (No.2016000026833ZK12) Science and Technology Innovational Serviceability Building Project of Beijing Municipal Education Commission (No.PXM2017_014223_000066) Excellent Talent Selection and Training Project of BIGC of China (No.04190117004/026) Institute level project of BIGC of China (No.Eb201502) 

主  题:non-thermal plasma(NTP) polymer permeability barrier layer surface modification 

摘      要:This review describes the application of non-thermal plasma(NTP) technology for high barrier layer fabrication in packaging *** technology is considered to be the most prospective approaches for the barrier layer fabrication over the past decades due to unpollution,high speed,*** applications of NTP technology have achieved numerous exciting results in high barrier packaging *** it seemly demands a detailed review to summarize the past works and direct the future *** review focuses on the different NTP resources applied in the high barrier area,the role of plasma surface modification on packaging film surface properties,and the deposition of different barrier coatings based on NTP *** particular,this review emphasizes the cutting-edge technologies of NTP on interlayer deposition with organic,inorganic for multilayer barriers *** future prospects of NTP technology in high barrier film areas are also described.

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