Determination of Interfacial Heat Flux of Stainless Steel Solidification on Copper Substrate During the First 0.2 s

作     者：张卫 于艳 方园 李建国 

作者机构：School of Materials Science and EngineeringShanghai Jiaotong University Baosteel Research InstituteBaosteel Co. Ltd 

出 版 物：《Journal of Shanghai Jiaotong university(Science)》 (上海交通大学学报（英文版）)

年 卷 期：2011年第16卷第1期

页      面：65-70页

核心收录：

学科分类：080602[工学-钢铁冶金] 08[工学] 0806[工学-冶金工程] 

主　　题：rapid solidification interfacial heat transfer heat flux 

摘      要：Interfacial heat transfer is a key issue in many solidification *** the paper,a novel experimental apparatus has been designed and on this basis,the instantaneous interfacial heat transfer between molten steel or solidified shell and copper substrate during the first 0.2 s has been *** investigated parameters include melt superheat,substrate temperature and surface *** results show that the peak value of the interfacial heat flux in the first stage of liquid/solid contact increases with melt superheat and changes slightly with substrate temperature and surface *** interfacial heat flux in the stage of solid/solid contact has a similar trend of slow decrease in most conditions.