Microstructure,wetting property of Sn-Ag-Cu-Bi-xCe solder and IMC growth at solder/Cu interface during thermal cycling

作     者：Yuan Wang Xiu-Chen Zhao Ying Liu Yong Wang Dong-Mei Li Yuan Wang;Xiu-Chen Zhao;Ying Liu;Yong Wang;Dong-Mei Li

作者机构：School of Materials Science and EngineeringBeijing Institute of TechnologyBeijing 100081China Center of Packaging and TestingBeijing Microelectronics Technology InstituteBeijing 100076China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2021年第40卷第3期

页      面：714-719页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：financially supported by the National Science and Technology Major Project of China(No.2011ZX02607) 

主　　题：Lead-free solder Rare earth element Microstructure Wettability Intermetallic compound Thermal cycling 

摘      要：The effects of adding small amounts of cerium(Ce) to Sn-3.3 Ag-0.2 Cu-4.7 Bi solder on microstructure,wettability characteristic,interfacial morphology and the growth of interfacial intermetallic compound(IMC) during thermal cycling were investigated by optical microscopy(OM),scanning electron microscopy(SEM) and solderability *** is found that the p-Sn phase,Ag_(3)Sn phase and Cu6 Sn5 phase in the solder are refined and the wetting force *** is an active element;it more easily accumulates at the solder/flux interface in the molten state,which decreases the interfacial surface energy and reduces the driving force for IMC formation on Cu substrate;therefore,the thickness of IMC at the solder/Cu interface decreases when appropriate Ce was added into the ***,the Ce-containing solders have lower growth rate of interfacial IMC than solders without Ce during the thermal cycling between-55 and 125℃.When the Ce content is 0.03 wt% in the Sn-3.3 Ag-0.2 Cu-4.7 Bi solder,the solder has the best wettability and the minimum growth rate of interfacial IMC layer.