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Light output improvement of GaN-based light-emitting diodes grown on Si (111) by a via-thin-film structure

Light output improvement of GaN-based light-emitting diodes grown on Si(111)by a via-thin-film structure

作     者:Zengcheng LI Bo Feng Biao Deng Legong Liu Yingnan Huang Meixin Feng Yu Zhou Hanmin Zhao Qian Sun Huaibing Wang Xiaoli Yang Hui Yang 

作者机构:Key Laboratory of Nanodevices and Applications Suzhou Institute of Nano-Tech and Nano-Bionics Chinese Academy of Sciences Suzhou 215123 China Lattice Power (Changzhou) Corporation Changzhou 213164 China Lattice Power (Jiangxi) Corporation Nanchang 330029 China Beijing Advanced Materials Development Center Beijing 100083 China 

出 版 物:《Journal of Semiconductors》 (半导体学报(英文版))

年 卷 期:2018年第39卷第4期

页      面:39-43页

核心收录:

学科分类:0808[工学-电气工程] 0809[工学-电子科学与技术(可授工学、理学学位)] 08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 0703[理学-化学] 0803[工学-光学工程] 0702[理学-物理学] 

基  金:Project supported by the National Key R&D Program(Nos.2016YFB0400100,2016YFB0400104) the National Natural Science Foundation of China(Nos.61534007,61404156,61522407,61604168,61775230) the Key Frontier Scientific Research Program of the Chinese Academy of Sciences(No.QYZDB-SSW-JSC014) the Science and Technology Service Network Initiative of the Chinese Academy of Sciences the Key R&D Program of Jiangsu Province(No.BE2017079) the Natural Science Foundation of Jiangsu Province(No.BK20160401) the China Postdoctoral Science Foundation(No.2016M591944) supported by the Open Fund of the State Key Laboratory of Luminescence and Applications(No.SKLA-2016-01) the Open Fund of the State Key Laboratory on Integrated Optoelectronics(Nos.IOSKL2016KF04,IOSKL2016KF07) the Seed Fund from SINANO,CAS(No.Y5AAQ51001) 

主  题:via thin film LED structure GaN-on-Si light-emitting diode light extraction 

摘      要:This work reports the fabrication of via-thin-film light-emitting diode (via-TF-LED) to improve the light output power (LOP) of blue/white GaN-based LEDs grown on Si (111) substrates. The as-fabricated via-TF-LEDs were featured with a roughened n-GaN surface and the p-GaN surface bonded to a wafer carrier with a silver-based reflective electrode, together with an array of embedded n-type via pillar metal contact from the p-GaN surface etched through the multiple-quantum-wells (MQWs) into the n-GaN layer. When operated at 350 mA, the via-TF- LED gave an enhanced blue LOP by 7.8% and over 3.5 times as compared to the vertical thin-film LED (TF-LED) and the conventional lateral structure LED (LS-LED). After covering with yellow phosphor that converts some blue photons into yellow light, the via-TF-LED emitted an enhanced white luminous flux by 13.5% and over 5 times, as compared with the white TF-LED and the white LS-LED, respectively. The significant LOP improve- ment of the via-TF-LED was attributed to the elimination of light absorption by the Si (111) epitaxial substrate and the finger-like n-electrodes on the roughened emitting surface.

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