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Hydromagnetic thin film flow of Casson fluid in non-Darcy porous medium with Joule dissipation and Navier's partial slip

Hydromagnetic thin film flow of Casson fluid in non-Darcy porous medium with Joule dissipation and Navier's partial slip

作     者:G.S.SETH R.TRIPATHI M.K.MISHRA 

作者机构:Department of Applied Mathematics Indian Institute of Technology (India School of Mines) Dhanbad 826004 India 

出 版 物:《Applied Mathematics and Mechanics(English Edition)》 (应用数学和力学(英文版))

年 卷 期:2017年第38卷第11期

页      面:1613-1626页

核心收录:

学科分类:080103[工学-流体力学] 08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 0802[工学-机械工程] 0701[理学-数学] 0801[工学-力学(可授工学、理学学位)] 

基  金:University Grants Commission of New Delhi in India  for providing funds to accomplish this research work 

主  题:fluid thin film non-Darcy medium velocity slip unsteady stretching sheet,Joule dissipation heat generation/absorption 

摘      要:In this paper, the effects of viscous and Ohmic heating and heat genera- tion/absorption on magnetohydrodynamic flow of an electrically conducting Casson thin film fluid over an unsteady horizontal stretching sheet in a non-Darcy porous medium are investigated. The fluid is assumed to slip along the boundary of the sheet. Similar- ity transformation is used to translate the governing partial differential equations into ordinary differential equations. A shooting technique in conjunction with the 4th order Runge-Kutta method is used to solve the transformed equations. Computations are car- ried out for velocity and temperature of the fluid thin film along with local skin friction coefficient and local Nusselt number for a range of values of pertinent flow parameters. It is observed that the Casson parameter has the ability to enhance free surface velocity and film thickness, whereas the Forchheimer parameter, which, is responsible for the inertial drag has an adverse effect on the fluid velocity inside the film. The velocity slip along the boundary tends to decrease the fluid velocity. This investigation has various applications in engineering and in practical problems such as very large scale integration (VLSI) of electronic chips and film coating.

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