A review of passive thermal management of LED module

作     者：叶怀宇 Sau Koh Henk van Zeijl A.W.J.Gielen 张国旗 

作者机构：Delft Institute of Microsystems and Nanoelectronics(Dimes) Delft University of Technology Materials Innovation Institute(M2i)Mekelweg 22628 CDDelftNetherlands Netherlands Organization for Applied Scientific Research(TNO) De Rondom 15612 APEindhovenNetherlands 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2011年第32卷第1期

页      面：57-60页

核心收录：

学科分类：0808[工学-电气工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0803[工学-光学工程] 0702[理学-物理学] 

基　　金：the support by Consumerizing Solid State Lighting(CSSL) 

主　　题：HB LEDs LED module thermal management passive thermal solution thermal interface material 

摘      要：Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module.