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Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

作     者:Shi Bai Shigang Zhang Weiping Zhou Delong Ma Ying Ma Pooran Joshi Anming Hu 

作者机构:Institute of Laser Engineering Beijing University of Technology School of Civil and Transportation Engineering Beijing University of Civil Engineering and Architecture Oak Ridge National Laboratory Department of Mechanical Aerospace and Biomedical Engineering University of Tennessee Knoxville 

出 版 物:《Nano-Micro Letters》 (纳微快报(英文版))

年 卷 期:2017年第9卷第4期

页      面:49-61页

核心收录:

学科分类:080202[工学-机械电子工程] 08[工学] 0802[工学-机械工程] 

基  金:supported by National Natural Science Foundation of China (51575016) the Beijing Oversea High-Level Talent Project strategic research Grant (KZ20141000500, B-type) of Beijing Natural Science Foundation P.R. China the support by the China Scholarship Council (20160654015) for his research stay at the Institute of Physical and Chemical Research,Wako, Japan 

主  题:Laser direct writing Copper circuit Stretchable sensor Laser reduction 

摘      要:Stretchable electronic sensing devices are defining the path toward wearable electronics. High-performance flexible strain sensors attached on clothing or human skin are required for potential applications in the entertainment,health monitoring, and medical care sectors. In this work,conducting copper electrodes were fabricated onpolydimethylsiloxane as sensitive stretchable microsensors by integrating laser direct writing and transfer printing approaches. The copper electrode was reduced from copper salt using laser writing rather than the general approach of printing with pre-synthesized copper or copper oxide nanoparticles. An electrical resistivity of 96 l X cm was achieved on 40-lm-thick Cu electrodes on flexible substrates. The motion sensing functionality successfully demonstrated a high sensitivity and mechanical *** in situ fabrication method leads to a path toward electronic devices on flexible substrates.

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