Effects of Zn, Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder

作     者：Xiaojing Wang Yanlai Wang Fengjiang Wang Ning Liu Jianxin Wang 

作者机构：School of Material and Science Engineering Jiangsu University of Science and Technology Key Laboratory of Semiconductor Photovoltaic Technology of Inner Mongolia Autonomous Region School of Physical Science and Technology Inner Mongolia University 

出 版 物：《Acta Metallurgica Sinica(English Letters)》 (金属学报（英文版）)

年 卷 期：2014年第27卷第6期

页      面：1159-1164页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：financially supported by the Natural Science Fund for Colleges and Universities in Jiangsu Province (Nos. 11KJB460003 and 12KJB460003) Jiangsu Planning Project of Science and Technology (No. SBK201241936) National Natural Science Foundation of China (No. 51201072) 

主　　题：Sn Bi Tensile test Microstructure 

摘      要：Effects of Zn, Zn-Al and Zn-P additions on melting points, microstructures, tensile properties, and oxidation behaviors of Sn-40 Bi lead-free solder were investigated. The experimental results show that the addition of these three types of elements can refine the microstructures and improve the ultimate tensile strength（UTS） of solder alloys. The fractographic analysis illustrates that ductile fracture is the dominant failure mode in tensile tests of Sn-40Bi-2Zn（SBZ）and Sn-40Bi-2Zn-0.005Al（SBZA） specimens, while brittle fracture is the controlled manner in Sn-40Bi-2Zn-0.005P（SBZP） and Sn-58 Bi solders. XPS analysis indicates that trace amounts of both Al and P additives in solder can improve the antioxidant capacity, whereas only the additive of Al in solder can reduce the thickness of oxidation film.