Copper matrix composites reinforced respectively with nano-SiO_2 and nano-AlN particles

作     者：吴玉程 王涂根 汪峰涛 任榕 王文芳 

作者机构：School of Materials Science and Engineering Hefei University of Technology Hefei 230009 China 

出 版 物：《中国有色金属学会会刊：英文版》 (Transactions of Nonferrous Metals Society of China)

年 卷 期：2005年第15卷第S3期

页      面：132-135页

核心收录：

学科分类：07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：Project(040020392)supportedbytheKeyProgramofScienceandTechnologyofAnhuiProvince project(20051004)supportedby2005AnnualKeyScientificProgramofHefei 

主　　题：powder metallurgy composite nano-particle resistivity hardness softening temperature 

摘      要：Two kinds of copper matrix composites reinforced respectively with nano-SiO2 and nano-AlN were prepared by powder metallurgy technique. The microstructure and properties of the composites were studied. The results show that the nano-SiO2 and nano-AlN distribution are uniform and the particulates also refine the grains. With the increase of nano-SiO2 and nano-AlN addition, the density of the both composites decreases, the resistivity increases, whereas the value of hardness reaches the maximum. Softening temperature of the two kinds of composites are above 700℃ which is very high in comparison with pure copper（about 400℃）. But with the same content of nano-SiO2 and nano-AlN particles, the hardness of Cu/AlN is much higher than that of Cu/SiO2, and the resistivity of Cu/AlN is close to that of Cu/SiO2. Thus the reinforcement effect of nano-AlN is better than that of nano-SiO2.