Heat transfer in high density electronics packaging

作     者：ZHOU Jie min 1, YANG Ying 1, DENG Sheng xiang 1, YI Zheng ming 1, WANG Xi tao 2, CHEN Liu 2, Johan Liu 2 (1.Department of Applied Physics and Heat Engineering, Central South University, Changsha 410083, China 2.Department of Production En 

作者机构：1. Department of Applied Physics and Heat Engineering Central South University 410083 Changsha China 2. Department of Production Engineering Chalmers University of Technology SE-41296 G?teborg Sweden 

出 版 物：《Journal of Central South University of Technology》 (中南工业大学学报（英文版）)

年 卷 期：2001年第8卷第4期

页      面：278-282页

核心收录：

学科分类：080701[工学-工程热物理] 08[工学] 0807[工学-动力工程及工程热物理] 

基　　金：TheNationalScienceFoundationofSweden 

主　　题：electronics packaging thermal reliability heat transfer 

摘      要：In order to get an insight into the thermal characteristic and to evaluate the thermal reliability of the System in Packaging(SIP), a new solution of electronics packaging, a heat transfer model of SIP was developed to predict the heat dissipation capacity and to investigate the effect of different factors on the tempe rature distribution in the electronics. The affecting parameters under consideration include the thermophysical properties of the substrates, the coefficient of convection heat transfer, the thickness of the chip, and the density of power dissipation. ALGOR, a kind of finite element analysis software,was used to do the model simulation. Based on the simulation and analysis of the heat conduction and convection resistance, criteria for the thermal design were established and possible measurement for enhancing power dissipation was provided. The results show that the heat transfer model provides a new and effective way to the thermal design and thermal analysis of SIP and to the mechanical analysis for the further investigation of SIP.