Growth behavior and microstructure of intermetallics at interface of AuSn20 solder and metalized-Ni layer

作     者：Xiao-feng WEI Xue-wei ZHU Ri-chu WANG 韦小凤;朱学卫;王日初

作者机构：College of Mechanical and Electronic Engineering Northwest A&F University Yangling 712100 China School of Materials Science and Engineering Central South University Changsha 410083 China 

出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报（英文版）)

年 卷 期：2017年第27卷第5期

页      面：1199-1205页

核心收录：

学科分类：080503[工学-材料加工工程] 0806[工学-冶金工程] 08[工学] 0818[工学-地质资源与地质工程] 0815[工学-水利工程] 0805[工学-材料科学与工程（可授工学、理学学位）] 0813[工学-建筑学] 0703[理学-化学] 0802[工学-机械工程] 0814[工学-土木工程] 0702[理学-物理学] 080201[工学-机械制造及其自动化] 

基　　金：Project(JPPT-125-GH-039)supported by the Ministry of Science and Technology of China Project(Z109021567)supported by Fundamental Research Funds for the Central Universities,China 

主　　题：AuSn20/Ni joint interfacial reaction growth kinetics volume diffusion mechanism 

摘      要：The AuSn20/Ni joints were prepared by the reflow soldering technology and then annealed at solid-state temperature to form diffusion *** interfacial reactions and the growth kinetics of the intermetallic compounds(IMC)at the AuSn20/Ni soldering interface were investigated by scanning electron microscopy(SEM)and electron probe microanalysis(EPMA).The results show that,the(Ni,Au)3Sn2phases are formed at the AuSn20/Ni interface after soldering *** thickness l of the IMC layer monotonically increases with increasing annealing time t according to the relationship l=k(t/t0)n,where the exponent n is0.527,0.476and0.471for393,433and473K annealing,*** indicates that the volume diffusion contributes to the growth of the IMC layer at the AuSn20/Ni interface at solid-sate *** pre-exponential factor K0=1.23×10?7m2/s and the activation enthalpy QK=81.8kJ/mol are obtained from the results of the parabolic coefficient K by a least-squares method.