Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature

作     者：Peng Peng Wei Guo Ying Zhu Lei Liu Guisheng Zou Y.Norman Zhou 

作者机构：School of Mechanical Engineering and AutomationBeihang UniversityBeijing 100191People’s Republic of China International Research Institute for Multidisciplinary ScienceBeihang UniversityBeijing 100191People’s Republic of China Department of Mechanical EngineeringTsinghua UniversityBeijing 100084People’s Republic of China Centre for Advanced Materials JoiningUniversity of WaterlooWaterlooON N2L 3G1Canada 

出 版 物：《Nano-Micro Letters》 (纳微快报（英文版）)

年 卷 期：2017年第9卷第3期

页      面：27-32页

核心收录：

学科分类：07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：supported by the National Natural Science Foundation of China(Grant Numbers 51375261,51520105007,51405258,51605019) support from the Beihang University,China,through Zhuoyue program 

主　　题：Nanojoining Bonding Diffusion Interface Nanoindentation 

摘      要：The controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire bonding might present opportunities for nanoscale packaging and nanodevice design.