Effect of ultrasonic power introduced by a mold copper plate on the solidification process
Effect of ultrasonic power introduced by a mold copper plate on the solidification process作者机构:school of metallurgy engineeringanhui university of technologyMa'anshan 243002China
出 版 物:《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报(英文版))
年 卷 期:2017年第24卷第2期
页 面:139-146页
核心收录:
学科分类:08[工学] 0806[工学-冶金工程] 080601[工学-冶金物理化学]
基 金:financially supported by the National Natural Science Foundation of China(Nos.51274004 and 51574001)
主 题:electroslag remelting mold ultrasonic solidification
摘 要:An electroslag furnace with ultrasonic vibration introduced by a mold copper plate was designed. The effects of ultrasonic power on the element distribution and compactness in electroslag remelting (ESR) ingots were studied, and the mechanism of ultrasonic assistance was analyzed in cold experiments. In the results, silicon, manganese and chromium are uniformly distributed at an ultrasonic power of 300-750 W. The absence of ultrasonic or higher ultrasonic power is not conducive to the uniformity of alloying elements. Carbon demon- strates a highly uneven distribution at 300 W, gradually reaches the uniform distribution as the ultrasonic power further increases, and shows the poor distribution at 1000 W. The compactness of ESR ingots gradually increases with increasing ultrasonic power and reaches the uni- form distribution at 500 W. A further increase in ultrasonic power does not improve the compactness. Introducing ultrasonic vibrations by a mold copper plate can improve the solidification quality; however, an appropriate ultrasonic power level should be determined.