The Residual Strain Measurement of Thin Conductive Metal Wire after Electrical Failure with SEM Moir

作     者：Yanjie Li Huimin Xie Qinghua Wang Mengmeng Zhou Manqiong Xu Qiang Luo Changzhi Gu 

作者机构：AML Department of Engineering Mechanics Tsinghua University School of Civil Engineering and Architecture University of Jinan National Institute of Advanced Industrial Science and Technology Institute of Physics Chinese Academy of Sciences 

出 版 物：《Acta Mechanica Solida Sinica》 (固体力学学报（英文版）)

年 卷 期：2016年第29卷第4期

页      面：371-378页

核心收录：

学科分类：080901[工学-物理电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0701[理学-数学] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：Project supported by the National Natural Science Foundation of China(Nos.11232008,11227801 and 11302082) the Doctoral Program of University of Jinan(No.XBS1307) 

主　　题：SEM moir′e residual strain metal wire focused ion beam(FIB) 

摘      要：In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moir′e. Focused ion beam(FIB) milling is applied to fabricate micron moir′e gratings on the surfaces of constantan wires and the random phase shifting technique is used to process moir′e fringes. The virtual strain method is briefly introduced and used to calculate the real strain of specimens. In order to study the influence of a defect on the electrical failure of the constantan wire, experiments were conducted on two specimens, one with a crack, while the other one without any crack. By comparing the results, we found that the defect makes the critical beam current of electrical failure decrease. In addition, the specimens were subjected to compression after electrical failure, in agreement with the observed crack closure of the specimen. The successful results demonstrate that the moir′e method is effective to characterize the full-field deformation of constantan wires on the polymer membrane, and has a good potential for further application to the deformation measurement of thin films.