Quantitative law of diffusion induced fracture

作     者：H.-J.Lei H.-L.Wang B.Liu C.-A.Wang 

作者机构：AMLCNMMDepartment of Engineering MechanicsTsinghua UniversityBeijing 100084China State Key Lab of New Ceramics and Fine ProcessingDepartment of Materials Science and EngineeringTsinghua UniversityBeijing 100084China 

出 版 物：《Acta Mechanica Sinica》 (力学学报（英文版）)

年 卷 期：2016年第32卷第4期

页      面：611-632页

核心收录：

学科分类：07[理学] 0802[工学-机械工程] 0701[理学-数学] 0702[理学-物理学] 0801[工学-力学（可授工学、理学学位）] 

基　　金：support from the National Natural Science Foundation of China(Grants.11372158,11425208,and 51232004) Tsinghua University Initiative Scientific Research Program(Grant.2011Z02173) 

主　　题：normalized hierarchical contour spacing quickly lithium validated battery constraint coordinate 

摘      要：Through dimension analysis, an almost analytical model for the maximum diffusion induced stress（DIS）and critical temperature（or concentration） difference at which cracks begin to initiate in the diffusion process is developed. It interestingly predicts that the spacing of diffusioninduced cracks is constant, independent of the thickness of specimen and the temperature difference. These conclusions are validated by our thermal shock experiments on alumina plates. Furthermore, the proposed model can interpret observed hierarchical crack patterns for high temperature jump cases, and a three-stage relation between the residual strength and the temperature difference. The prediction for crack spacing can guide the biomimetic thermal-shockfailure proof design, in which the hard platelets smaller than the predicted diffusion induced by constant crack-spacing are embedded in a soft matrix, and, therefore, no fracture will happen. This may guide the design of the thermal protection system and the lithium ion battery. Finally we present the maximum normalized DISes for various geometry and boundary conditions by single-variable curves for the stressindependent diffusion process and two-variable contour plots for the stress-dependent diffusion process, which can provideengineers and materialists a simple and easy way to quickly evaluate the reliability of related materials and devices.