Thermal Resistance Testing Technology Research of Integration High Power-LED

作     者：Ping Xue Chang-Hong Jia Xu-Sheng Wang Hao Sun 

作者机构：Optic & Electronic Engineering Research CenterHarbin University of Science and Technology 

出 版 物：《Journal of Harbin Institute of Technology(New Series)》 (哈尔滨工业大学学报（英文版）)

年 卷 期：2013年第20卷第2期

页      面：106-110页

核心收录：

学科分类：0810[工学-信息与通信工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：Sponsored by the Heilongjiang Provincial Project(Grant No.12511121) the Harbin City Innovation Talent Project(Grant No.2011RFXXG019) the National Science and Technology Support Project(Grant No.2012BAH28F02) 

主　　题：thermal resistance junction temperature integrated high power LED cooling 

摘      要：In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.