NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER

作     者：C. Q. Wang M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology, H. I. T., Harbin 150001, China) 

出 版 物：《Acta Metallurgica Sinica(English Letters)》 (金属学报（英文版）)

年 卷 期：2000年第13卷第1期

页      面：168-172页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

主　　题：pulse modulated continuous wave laser,finite element analysis forced vibration 

摘      要：The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball.