Oxidation of silicon surface with atomic oxygen radical anions
Oxidation of silicon surface with atomic oxygen radical anions作者机构:Department of Chemical Physics University of Science & Technology of China Department of Physics University of Science & Technology of China
出 版 物:《Chinese Physics B》 (中国物理B(英文版))
年 卷 期:2008年第17卷第6期
页 面:2197-2203页
核心收录:
学科分类:07[理学] 070205[理学-凝聚态物理] 0805[工学-材料科学与工程(可授工学、理学学位)] 0704[理学-天文学] 0702[理学-物理学]
基 金:Project supported by the National Natural Science Foundation of China (Grant No 50772107) the National High Technology Development Program of China (Grant No 2006AA05Z118)
主 题:O^- anions silicon oxidation MOS capacitor electrical properties
摘 要:The surface oxidation of silicon (Si) wafers by atomic oxygen radical anions (O- anions) and the preparation of metal-oxide-semiconductor (MOS) capacitors on the O-oxidized Si substrates have been examined for the first time. The O- anions are generated from a recently developed O- storage-emission material of [Ca24Al2sO64]^4+·4O^- (Cl2A7-O^- for short). After it has been irradiated by an O- anion bean: (0.5 μA/cm^2) at 300℃ for 1-10 hours, the Si wafer achieves an oxide layer with a thickness ranging from 8 to 32 nm. X-ray photoelectron spectroscopy (XPS) results reveal that the oxide layer is of a mixture of SiO2, Si2 O3, and Si2O distributed in different oxidation depths. The features of the MOS capacitor of 〈Al electrode/SiOx/Si〉 are investigated by measuring capacitance-voltage (C - V) and current-voltage (I - V) curves. The oxide charge density is about 6.0 × 10^1 cm^-2 derived from the (C - V curves. The leakage current density is in the order of 10^-6 A/cm^2 below 4 MV/cm, obtained from the I - V curves. The O- anions formed by present method would have potential applications to the oxidation and the surface-modification of materials together with the preparation of semiconductor devices.