Particle contamination, the disruption of electronic connectors in the signal transmission system

作     者：ZHANG Ji-gao 

作者机构：Research Lab of Electric Contacts Beijing University of Posts ＆ Telecommunications Beijing 100876 China 

出 版 物：《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 (浙江大学学报（英文版）A辑（应用物理与工程）)

年 卷 期：2007年第8卷第3期

页      面：361-369页

核心收录：

学科分类：12[管理学] 1201[管理学-管理科学与工程(可授管理学、工学学位)] 07[理学] 070104[理学-应用数学] 070105[理学-运筹学与控制论] 0701[理学-数学] 

基　　金：Project (No. 50277002) supported by the National Natural ScienceFoundation of China 

主　　题：Dust Particle contamination Micro motion Corrosion 

摘      要：Particle pollution in air, also sometimes known as fine dust contamination, may cause electric contact failure. Recent research further proved that the fine particle is becoming a major disruption of the electronic connectors in signal transmission system. This paper specifies the connector contact in mobile phone application. To study the contact failure of mobile phone, a series of inspections and analytical research methods are introduced. Special features that cause the contact failure are summarized. Particle accumulation is the main problem; organic material such as lactates from sweat of the human body may act as adhesives to stick the separate particles together and make them adhere on the contact surface; chemical properties of dust cause serious local corrosion. The corrosion products may trap the particles and firmly attach on the contact surface; micro motion frequently occurs at the contact interface. Hard particle can be embedded into the surface, and soft particle could be squeezed and inserted into the contact; silicon compounds in dust play the most important role in forming high resistance regions that lead to failure; deposition of particles depends on the amount of materials, static electricity attracting force and gravity force applied on the particles. Current dust test can hardly reflect the serious contact failure. It is difficult to simulate the complexity of contact failure caused by particle contamination. Thus alternative ways of simulation experiment and improvement of contact reliability are proposed.