Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication

作     者：XU Ke TIAN XiaoJun YU HaiBo YANG Yang ZHOU Lei LIU LianQing 

作者机构：State Key Laboratory of RoboticsShenyang Institute of Automation Chinese Academy of Sciences Information & Control Engineering Faculty Shenyang Jianzhu University 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2014年第57卷第4期

页      面：734-737页

核心收录：

学科分类：080202[工学-机械电子工程] 08[工学] 0804[工学-仪器科学与技术] 0802[工学-机械工程] 

基　　金：supported by the National Natural Science Foundation of China(Grant No.51005230) China Postdoctoral Science Foundation(Grant No.2012M520654) the Education Department of Liaoning Province Science and Ttechnology Research Projects(Grant No.L2012213) 

主　　题：large-scale assembly Cu/CuO nanowires floating potential di-electrophoresis 

摘      要：To improve the efficiency of nano-electronic device fabrication, a new method named floating electrical potential assembly is proposed to realize large-scale assembly of Cu/CuO nanowires, The simulation of floating electrical potential distribution on the micro-electrode chip is performed by COMSOL software, and the simulation result shows that the coupled electrical poten- tial on the floating drain electrodes is very close to the original electrical potential applied on the gate electrode, whicb means that the method can provide di-electrophoresis （DEP） force for all the electrode pairs at one time, thus realizing large-scale as- sembly at one time. With Cu/CuO nanowires well dispersed and micro-electrode chip fabrication, nanowires assembly experiments are performed and the experimental results show that Cu/CuO nanowires are assembled at hundreds of micro-electrodes pairs at one time, and the success rate of nanowires assembly also reaches 90%.