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A Novel Asymmetric Check Microvalve for Suppressing Flow Boiling Instability in Microchannels

作     者:ZHOU Fan ZHAO Yang YIN Ershuai HU Dinghua LI Qiang 

作者机构:MIIT Key Laboratory of Thermal Control of Electronic EquipmentSchool of Energy and Power EngineeringNanjing University of Science and Technology 

出 版 物:《Journal of Thermal Science》 (热科学学报(英文版))

年 卷 期:2024年第33卷第6期

页      面:2336-2347页

核心收录:

学科分类:080701[工学-工程热物理] 08[工学] 0807[工学-动力工程及工程热物理] 

基  金:the financial support from the National Natural Science Foundation of China with Grant No.52276070 the Fundamental Research Funds for the Central Universities with Grant No.30922010903 

主  题:bubble dynamics flow boiling instability microchannel topology optimization 

摘      要:Flow boiling in microchannels has attracted wide attention due to its excellent heat transfer capability,but flow boiling instability is a huge challenge limiting its *** can lead to a series of problems,such as uneven flow distribution,temperature and pressure drop *** work proposes a novel asymmetric check microvalve(ACMV) structure,exhibiting high ratio of resistance between the reverse and forward *** results show the reverse pressure drop of the ACMV structure is 2.06 times that of the forward pressure drop,and the forward flow resistance of the ACMV structure is 16% smaller than that of the conventional inlet *** addition,bubble dynamics of an isolated bubble in the generated channel under dual outlet condition was numerically *** is found that the bubble grows symmetrically in the rectangular channel upstream and *** distance of bubble movement downstream in the microchannel with ACMV is three times that of the microchannel with inlet *** microchannel with ACMV can suppress the backflow of isolated bubble better than microchannel with inlet ***,the growth of the bubble downstream extends the effective evaporation domain,which contributes to the enhanced bubble growth *** ACMV is expected to be a potential replacement for the conventional inlet restrictor,which provides a novel and efficient solution for future heat dissipation from high power devices.

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