Optimization of multicomponent SnBiInSbx low-temperature solder with varied Sb contents
作者机构：State Key Laboratory of Advanced Brazing Filler Metals&TechnologyZhengzhou Research Institute of Mechanical Engineering Co.Ltd.Zhengzhou 450001HenanChina State Key Laboratory of Advanced Brazing Filler Metals&TechnologyZhengzhou Research Institute of Mechanical Engineering Co.Ltd.Zhengzhou 450001HenanChina School of Mechatronic Engineering and AutomationFoshan UniversityFoshan 528225GuangdongChina College of Materials Science and EngineeringTaiyuan University of Science and TechnologyTaiyuan 030024ShanxiChina
出 版 物：《钢铁研究学报（英文版）》 (Journal of Iron and Steel Research, International)
年 卷 期：2024年第31卷第10期
页 面：2600-2609页
核心收录：
基 金：Key Research and Development Projects in Henan Province China (231111231500)
主 题：Microstructure Low melting point Second-phase strengthening Sb addition Electronic packaging
摘 要：The drive toward miniaturization,functionalization,and environmental conservation in electronic devices has increased the demand for low-temperature solder in 3D packaging *** influence of Sb incorporation on the structure and properties of SnBiIn solder at an equal molar ratio is *** is demonstrated that Sb incorporation facilitates the formation of SnIn phase and induces the precipitation of spherical Bi ***,the concentration of Sb directly affects the morphologies of both Bi and SbIn *** amount of Sb also directly impacts the morphologies of Bi and SbIn phases,resulting in distinct solid solution and second-phase strengthening *** effects consequently alter the properties of the *** phenomenon arises because Sb hinders atomic diffusion within the joint,leading to the formation of thin Cu6(Sn,In)5 intermetallic *** can be reasonably inferred that lead-free low-temperature solders,based on high-entropy alloy multicomponent compositions and engineered via elemental modulation,show pro-mise for successful applications in electronic packaging.
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