微米级铜-银双金属粉镀层结构及其抗氧化性
Plating Structure and Antioxygenation of Micron Cu-Ag Bimetallic Powder作者机构：华北工学院化工系太原030051
出 版 物：《物理化学学报》 (Acta Physico-Chimica Sinica)
年 卷 期：2000年第16卷第4期
页 面：366-369页
核心收录：
学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术]
摘 要：The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other *** was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag *** greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion *** copper powder plated by silver with full packaging structure can not be oxidized even at
维普期刊数据库
同方期刊数据库