THERMAL PROCESS OF VACUUM FLUXLESS LASER SOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING

作     者：Wang Chunqing Li Mingyu SunFujiang Feng Wufeng (National key laboratory of welding, Harbin Institute of Technology) 

作者机构：哈尔滨工业大学 现代焊接生产技术国家重点实验室 黑龙江 哈尔滨 

出 版 物：《Chinese Journal of Mechanical Engineering》 (中国机械工程学报（英文版）)

年 卷 期：2000年第13卷第2期

页      面：127-133页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：This project is supported by National Natural Science Foundation of China !(59671063) 

主　　题：Fluxless soldering Soldering thermal process Spreading and wetting 

摘      要：In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.