Combination Approach of FEM and Circuit System in IR Drop Analysis and Its Applications

作     者：唐章宏 袁建生 

作者机构：State Key Laboratory of Power SystemDepartment of Electrical EngineeringTsinghua University 

出 版 物：《Tsinghua Science and Technology》 (清华大学学报（自然科学版（英文版）)

年 卷 期：2008年第13卷第6期

页      面：850-857页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 

主　　题：finite element method printed circuit board integrated circuit package IR drop voltage regulator module modified nodal analysis 

摘      要：A method was developed to solve the combined system of the current field and the circuit. The ＂super-node＂ was used to transform the matrix for conventional nodal analyses of a circuit system from non-positive definite to positive definite. Then, a positive definite matrix for the overall system was obtained by combining the matrix from the circuit nodal analysis method and the matrix resulted from finite element method （FEM） formulation to solve the FEM fields. This approach has been successfully applied to simulate the electrical potential and current distributions on each metal layer of printed circuit boards （PCBs） and integrated circuit （IC） packages for a given power supply. The simulation results can then be used to analyze the properties of the PCBs and IC packages such as the port resistances and IR drops. The results can also be used to optimize PCB and IC package designs, such as by adjusting the power/ground distribution networks.