A Hybrid Integrated and Low-Cost Multi-Chip Broadband Doherty Power Amplifier Module for 5G Massive MIMO Application

作     者：Fei Huang Guansheng Lv Huibo Wu Wenhua Chen Zhenghe Feng 

作者机构：Department of Electronic EngineeringTsinghua UniversityBeijing 100084China 

出 版 物：《Engineering》 (工程（英文）)

年 卷 期：2024年第38卷第7期

页      面：223-232页

核心收录：

学科分类：080902[工学-电路与系统] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 

基　　金：supported in part by the National Key Research and Development Program of China(2021YFA0716601) the National Science Fund(62225111) 

主　　题：5G Doherty power amplifier Multi-input multi-output Multi-chip modules Hybrid integrated 

摘      要：In this paper,a hybrid integrated broadband Doherty power amplifier(DPA)based on a multi-chip module(MCM),whose active devices are fabricated using the gallium nitride(GaN)process and whose passive circuits are fabricated using the gallium arsenide(GaAs)integrated passive device(IPD)process,is proposed for 5G massive multiple-input multiple-output(MIMO)*** inverted DPA structure with a low-Q output network is proposed to achieve better bandwidth performance,and a single-driver architecture is adopted for a chip with high gain and small *** proposed DPA has a bandwidth of 4.4-5.0 GHz that can achieve a saturation of more than 45.0 *** gain compression from 37 dBm to saturation power is less than 4 dB,and the average power-added efficiency(PAE)is 36.3%with an 8.5 dB peak-to-average power ratio(PAPR)in 4.5-5.0 *** measured adjacent channel power ratio(ACPR)is better than
50 dBc after digital predistortion(DPD),exhibiting satisfactory linearity.