A review on adhesion behavior of chip seal pavement and aggregate
作者机构:Key Laboratory of Road Structure and Material of Ministry of Transport(Changsha)Changsha University of Science and TechnologyChangsha 410114China School of Traffic and Transportation EngineeringChangsha University of Science and TechnologyChangsha 410114China Wuhan Huike Testing Co.Ltd.Wuhan 430000China Department of Civil EngineeringUniversity of OttawaON KIN 6N5Canada CCCC Infrastructure Maintenance Group Co.Ltd.Beijing 100102China
出 版 物:《Journal of Traffic and Transportation Engineering(English Edition)》 (交通运输工程学报(英文版))
年 卷 期:2024年第11卷第3期
页 面:441-466页
核心收录:
学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)]
基 金:supported by National Natural Science Foundation of China(No.52108396) Open Fund of Key Laboratory of Road Structure and Material of Ministry of Transport(Changsha University of Science and Technology)(No.kfj210301)
主 题:Chip seal Adhesion behavior Asphalt binder Aggregate
摘 要:Chip seal is widely used for preventive maintenance to mitigate pavement deterioration,but it is prone to aggregate loss during pavement *** further promote the development and application of chip seals in road engineering in China,the research progress of the adhesion behavior of aggregate and binder in chip seals was reviewed in this paper,focusing on the adhesion mechanism of emulsified asphalt and alkaline *** Influencing factors and evaluation methodology of chip seals aggregate adhesion behavior were also *** results demonstrate that the adhesion process between emulsified asphalt and alkaline aggregate is divided into three processes including infiltration,demulsification,and cluster,which is more complicated when compared to hot *** designing a chip seal,not only the characteristics of single material should be paid attention to,but also the combination of binder and aggregate matters a *** form good adhesion between aggregate and asphalt binder,various influencing factors such as material selection,design method,and construction technical index should be considered comprehensively in the whole design,construction,and operation *** methods for evaluating adhesion behavior are summarized,including macroscopic adhesion performance tests,image analysis technology,and model *** is not objective to evaluate the aggregate adhesion behavior of chip seal only by a single evaluation method.A comprehensive evaluation based on the micro-macro multi-scale method should be considered in the future.